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Fast Facts

Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2008)

Dec 10, 2008 - Dec 12, 2008
Convention and Exhibition Center (COEX) Seoul, South Korea
 

Highlights

The EDPAS Symposium is to enhance the technical awareness and depth in the Asia region specifically in area of package and system electrical design concepts, issues, and challenges ahead for next generation electronic products.


Event Profiles

Sponsors: IEEE Components, Packaging and Manufacturing Technology Society (CPMT),Korean Institute of Electromagnetic Enginering and Science(KIEES), Korean Advanced Institute of Science and Tehnology,Ministry of Information and Communication

Contact Details

Email address:
Event website: http://www.edaps2008.org/
Phone: +82-(0)2-783-3473~4
Fax: +82-783-3475

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